Apple is in the process of testing advanced CMOS image sensors (CIS) from Samsung, a development that might make its way into the iPhone 16 later this year, according to a report from The Elec.
Currently, Apple is in the final stages of quality assessment of these CIS from Samsung System LSI, Samsung’s semiconductor division. These new sensors are intended for the primary camera of the forthcoming iPhone 16. Traditionally, Apple has relied solely on Sony for providing CIS in its iPhones. However, due to issues concerning reliability and the need for integrating newer technologies in its camera systems, Apple appears to be shifting its strategy away from Sony.
This change was prompted by challenges Apple encountered with Sony’s sensors last year, leading to delays in the iPhone 15 launch schedule. Consequently, Apple commissioned Samsung to start developing new image sensors in 2023.
Should Samsung’s sensors meet Apple’s rigorous quality standards, this would mark the first instance of Samsung supplying CIS for iPhones. The sensor being developed by Samsung boasts a sophisticated three-wafer stack architecture, enhancing the design over the existing two-stack models used in current iPhones. This new three-layer setup segregates the photodiode, transistors, and analog-digital converter logics into separate wafers, which helps in achieving higher pixel density, reduced noise levels, and smaller pixel dimensions.
The innovative design also features wafer-to-wafer hybrid bonding technology, which utilizes copper pads to connect the wafers directly, thereby eliminating traditional signal-transferring bumps. This enhancement not only reduces the overall size of the CIS but also improves the speed of data transfer.
Looking ahead, the iPhone 16 is anticipated to launch this fall, and it is expected to include several new camera functionalities, such as a dedicated “Capture” button, a 48-megapixel Ultra Wide camera, among other upgrades.
 from Samsung, a development that might make its way into the iPhone 16.){kind=link}