Apple and Samsung are collaborating on a groundbreaking project to enhance RAM performance for future iPhones. According to reports, Apple aims to improve memory bandwidth to support its AI platform, Apple Intelligence, in handling demanding on-device tasks. The new RAM design is expected to debut in the iPhone 18 series, set for release in 2026.
Reimagining RAM Design for Speed
While most smartphones integrate RAM into the same package as the processor, Apple plans to separate them into distinct chips. This approach allows for a larger DRAM package and faster memory access, crucial for handling intensive AI operations. Additionally, separating RAM from the processor can help mitigate heat issues that arise during high workloads.
Samsung, Apple’s key partner in this project, has begun researching innovative methods to package DRAM memory while maintaining the iPhone’s compact design. However, the shift to discrete RAM poses challenges, such as accommodating the extra space within the device without compromising battery size or performance.
High-Bandwidth Memory: A Missed Opportunity?
Apple reportedly considered using high-bandwidth memory (HBM), commonly found in servers, for this project. However, HBM’s physical size and high power consumption made it impractical for smartphones. Instead, the new approach seeks to balance performance improvements with the size and power constraints of an iPhone.
The Road Ahead
Samsung’s research is still in its early stages, but industry experts expect the new RAM design to significantly enhance Apple Intelligence’s performance. By prioritizing faster data access and efficient heat management, Apple aims to deliver smoother and more capable AI experiences on its devices.
With the iPhone 18 poised to showcase this innovative technology, Apple and Samsung’s partnership underscores a shared commitment to advancing mobile computing. The collaboration could set a new standard for AI integration in consumer electronics.
